Radio Boards
- EFR32BG13 2.4 GHz 10 dBm (SLWRB4104A)
- EFR32MG12 2.4 GHz 19 dBm (SLWRB4161A)
- EFR32MG12 2400/868-915 MHz 19 dBm Dual Band (SLWRB4170A)
- EFR32xG21 2.4 GHz 20 dBm (SLWRB4180A)
- EFR32FG1 2400/868 MHz 13 dBm Dual Band (SLWRB4250B)
- EFR32FG13 2400/915 MHz 19 dBm Dual Band (SLWRB4255A)
- WGM160P Wi-Fi Module (SLWRB4321A)
- EFR32xG24 2.4 GHz 20 dBm (xG24-RB4187C)
Overview
Radio Boards are used together with a Wireless Mainboard, which is a development platform for application development and debugging of wireless products.
There are two main variants of the Mainboard:
Wireless Starter Kit Mainboard (board BRD4001A, available standalone as SLWMB4001A)
Wireless Pro Kit Mainboard (board BRD4002A, available standalone as Si-MB4002A)
The Wireless Pro Kit Mainboard is a strict superset of the Wireless Starter Kit, the two boards are pin compatible for all shared functionality.
Wireless Starter Kits and Wireless Pro Kits are kits that bundle one or more Radio Boards with one or more Mainboards.
In Zephyr, Radio Boards are used as board targets, irrespective of whether the board was acquired standalone or as part of a Starter Kit or Pro Kit. The kit name of the standalone Radio Board is used as the board target.
Hardware
Wireless Starter Kit Mainboard:
Advanced Energy Monitor providing real-time information about energy consumption at up to 10 ksps
Packet Trace Interface
Virtual COM port
On-board Segger J-Link debugger with USB and Ethernet interfaces
Ultra-low power 128x128 pixel memory LCD
2 user buttons and 2 LEDs
20 pin 2.54mm expansion header
Si7021 Relative Humidity and Temperature Sensor
Breakout pads for Wireless SoC I/O
Wireless Pro Kit Mainboard:
Advanced Energy Monitor providing real-time information about energy consumption at up to 100 ksps
Packet Trace Interface
Virtual COM port
On-board Segger J-Link debugger with USB and Ethernet interfaces
Ultra-low power 128x128 pixel memory LCD
2 user buttons, joystick and 2 LEDs
20 pin 2.54mm expansion header
Si7021 Relative Humidity and Temperature Sensor
Breakout pads for Wireless SoC I/O